3D IC and Chiplets

 

The rise of AI has increased the demand for advanced semiconductor chips. This can only be achieved by integrating as many functions as possible into a system-on-chip (SoC), making them smaller and more reliable. 

Chiplets are modular semiconductor components designed and manufactured separately, then integrated into a larger system. This approach is like an SoC on a module, where each chiplet works with others, requiring co-optimisation during design. Chiplets also make better use of wafer corner space and have a lower defect rate, especially in large SoCs with many functions. Since each chiplet can be tested individually before integration, this improves manufacturing yield, output quality, and reduces costs. 

The industry is adopting now with 3D heterogeneous integration. This technology stacks memory and logic units vertically instead of placing them side by side. By doing this, data pathways are shortened, which improves energy efficiency and increases interconnect density. 

3D-IC technology is still in its early stages. However, by adopting Chiplets and 3D-ICs, companies can secure a competitive advantage in this evolving market.