Laser Based 3D Semiconductor

 

the Scientists have created a laser-based method to align 3D semiconductor chips with atomic precision, unlocking new possibilities in chipdesign, sensor technology, and manufacturing efficiency. 

Semiconductors are essential for powering electronics, but 2D chip designs have hit their limits. To move forward, engineers now stack chips into 3D structures. These stacks must be perfectly aligned — a challenge when even a billionth of a meter matters.

Traditional microscopes can't handle this level of precision. They can't focus on multiple layers at once, and even slight movements cause misalignment. They're also limited by how small a detail they can see.

Researchers overcame this using tiny metalenses. When hit with laser light, these lenses create holograms that reveal misalignments instantly — down to 0.017 nanometers.

This breakthrough could slash chip-making costs and unlock new sensors for detecting pressure, heat, and motion.