3D Cooling

 

the Smaller, more powerful chips create intense heat in tight spaces. A new cooling method using 3D microchannels and two-phase water flow offers a promising solution to this challenge.

Moore’s Law has driven decades of chip advancements, making electronics faster and more compact. However, smaller chips generate more heat in tighter spaces. Existing cooling systems are reaching their limits, posing a major challenge for the next generation of high-performance devices.

To solve this, researchers have developed a new cooling method using tiny 3D microchannels built into the chip. These channels circulate water to remove heat. Traditional systems rely on sensible heat, which is limited by the temperature rise before boiling. The new method uses latent heat, released during boiling, which is about seven times more effective.

Two-phase cooling—using both liquid and vapor states—can significantly boost efficiency. However, it requires careful control of vapor flow and heat transfer. Researchers designed special microchannel shapes and capillary systems that regulate water flow and improve cooling performance under different conditions.

This new design achieved a record cooling efficiency, greatly outperforming current methods.