Photonic 3D

 

the researchers developed a 3D photonic-electronic chip that solves AI’s energy-intensive data transfer problem by merging light-based communication with electronics for faster, more efficient performance.

AI systems require rapid data transfer, but current hardware often wastes energy and limits performance. This new chip design significantly improves bandwidth and energy efficiency, helping overcome these long-standing limitations in computing infrastructure.

The compact chip integrates 80 photonic transmitters and receivers, achieving high data rates of 800 Gb/s while consuming just 120 femtojoules per bit. With a bandwidth density of 5.3 Tb/s/mm², it sets a new standard for energy-efficient performance.

This innovation redefines how data flows between processing units. By 3D-integrating photonic and electronic components, it supports distributed AI systems and real-time applications, while also being affordable to produce using commercial manufacturing methods.